OKTEK G-5003 - LS/LR 油墨攪拌脫泡機 | 為無鉛高密度基板組裝的完美品質而創造的極致動能攪拌機 |
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攪拌前 |
> | 攪拌後 |
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UV膠脫泡 (前) |
> | 後 |
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熱固型防焊油墨 (前) |
> | 後 |
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PCB防焊綠漆 (前) 攪拌混和膠類 |
> | 後 |
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單一膠類 脫泡 (前) 絕緣漆 |
> | 後 導電油墨 |
岡業科技長期致力於業界各種材料的攪拌及脫泡研究,期許提供給客戶最佳的攪拌、脫泡效果。相關的研究結果已陸續取得或申請專利中,請勿仿冒,否則必定追究相關法律責任。 |
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OKTEK G-5003 LS/LR Ink Mixer and Defoamer (Air Bubble Remover) | R&D for Best Mixing Solution: Ink for Printed Circuit Boards, A/B paste and Ag (Silver) paste mixing and defoaming solution. |
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Before Mixing |
> | After Mixing |
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UV Paste (Before) |
> | After |
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Thermosetting Solder Paste (Before)
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> | After |
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PCB Solder Paste (Before) Mix&Defoam |
> | After |
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Single Paste Defoaming (Before) Insulated Ink |
> | After Conductive Ink |
OKTEK has made long-term commitment to provide our customers with the best mixing and defoaming (air bubble removing) machinery. Our G-5003A is currently patent pending. Do not counterfeit, or else, legal actions will be taken. |
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